Niobium Sputtering Target PlanarNb99.95%

Общая информация

  • Чистота: 99.9%, 99.95%
  • Размер: Diameter: 1-8; Thickness:0.125/0.25
  • Тип: Planar Target

CAS No.: 7440-03-1

Niobium Sputtering Target is produced by EB melting technology, it’s usually applied for touch screen, optical lenses and glass coatingusually applied for touch screen, optical lenses and glass coating.

niobium sputtering target

Niobium Sputtering Target is a thin discs or sheets made of high purity niobium that are used in sputtering processes to deposit thin films onto a substrate.

Shapes Of Niobium Sputtering Target: plane sputtering target, multi-arc sputtering target, step sputtering target, rotary sputtering target and special-shaped sputtering target.

The process with sputter targets is repeatable and can be scaled up from small research and development projects. The proses with sputter targets can be adapted to the production batches involving medium to large substrate areas.

The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters.

Many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the area.

Applications of Sputtering Targets

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from atargetsource onto asubstratesuch as a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy
    is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.

Sputtering targets has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Yutong Metal offers a wide range of specifications and sizes for various Niobium (Nb) products, including sputtering targets (circular, square, tubular, and irregular), coating materials, cylinders, cones, particles, foils, powders, 3D printing powders, nanometer powders, wire rods, ingots, and blocks.

Properties Of Niobium Sputtering Target


Механические свойства

Element Value
Material condition Hard
Material condition Soft
Poisson’s ratio 0.397
Poisson’s ratio 0.397
Bulk modulus( GPa ) 170.3
Bulk modulus( GPa ) 170.3
Tensile modulus( GPa ) 104.9
Tensile modulus( GPa ) 104.9
Izod toughness( J m⁻¹ ) 10-120
HardnessVickers( kgf mm⁻² ) 115
HardnessVickers( kgf mm⁻² ) 160
Tensile strength( MPa ) 330
Tensile strength( MPa ) 585
Yield strength( MPa ) 550
Yield strength( MPa ) 240

Electrical Properties

Element Value
Electrical resistivity( µOhmcm ) 16@20@20°C
Superconductivity critical temperature( K ) 9.25
Temperature coefficient( K⁻¹ ) 0.0026@0-100°C

Physical Properties

Element Value
Boiling point( C ) 4742
Density( gcm⁻³ ) 8.57@20°C

Thermal Properties

Element Value
Melting point( C ) 2468
Latent heat of evaporation( J g⁻¹ ) 7360
Latent heat of fusion( J g⁻¹ ) 290
Specific heat( J K⁻¹ kg⁻¹ ) 268@25°C
Thermal conductivity( W m⁻¹ K⁻¹ ) 53.7@0-100°C
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) 7.2@0-100°C