CAS No.: 7440-03-1
Niobium Sputtering Target is produced by EB melting technology, it’s usually applied for touch screen, optical lenses and glass coatingusually applied for touch screen, optical lenses and glass coating.
Niobium Sputtering Target is a thin discs or sheets made of high purity niobium that are used in sputtering processes to deposit thin films onto a substrate.
Shapes Of Niobium Sputtering Target: plane sputtering target, multi-arc sputtering target, step sputtering target, rotary sputtering target and special-shaped sputtering target.
The process with sputter targets is repeatable and can be scaled up from small research and development projects. The proses with sputter targets can be adapted to the production batches involving medium to large substrate areas.
The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters.
Many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the area.
Applications of Sputtering Targets
- Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a “target” source onto a “substrate” such as a silicon wafer.
- Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy
is needed and selectivity is not a concern. - Sputter targets is also used for analysis by etching away the target material.
Sputtering targets has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
Yutong Metal offers a wide range of specifications and sizes for various Niobium (Nb) products, including sputtering targets (circular, square, tubular, and irregular), coating materials, cylinders, cones, particles, foils, powders, 3D printing powders, nanometer powders, wire rods, ingots, and blocks.
Properties Of Niobium Sputtering Target
Механические свойства
Element | Value |
---|---|
Material condition | Hard |
Material condition | Soft |
Poisson’s ratio | 0.397 |
Poisson’s ratio | 0.397 |
Bulk modulus( GPa ) | 170.3 |
Bulk modulus( GPa ) | 170.3 |
Tensile modulus( GPa ) | 104.9 |
Tensile modulus( GPa ) | 104.9 |
Izod toughness( J m⁻¹ ) | 10-120 |
Hardness – Vickers( kgf mm⁻² ) | 115 |
Hardness – Vickers( kgf mm⁻² ) | 160 |
Tensile strength( MPa ) | 330 |
Tensile strength( MPa ) | 585 |
Yield strength( MPa ) | 550 |
Yield strength( MPa ) | 240 |
Electrical Properties
Element | Value |
---|---|
Electrical resistivity( µOhmcm ) | 16@20@20°C |
Superconductivity critical temperature( K ) | 9.25 |
Temperature coefficient( K⁻¹ ) | 0.0026@0-100°C |
Physical Properties
Element | Value |
---|---|
Boiling point( C ) | 4742 |
Density( gcm⁻³ ) | 8.57@20°C |
Thermal Properties
Element | Value |
---|---|
Melting point( C ) | 2468 |
Latent heat of evaporation( J g⁻¹ ) | 7360 |
Latent heat of fusion( J g⁻¹ ) | 290 |
Specific heat( J K⁻¹ kg⁻¹ ) | 268@25°C |
Thermal conductivity( W m⁻¹ K⁻¹ ) | 53.7@0-100°C |
Coefficient of thermal expansion( x10⁻⁶ K⁻¹ ) | 7.2@0-100°C |